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Dynamic changes in distribution of mechanical strain generated during wire bonding in Si under and near the bonding pad were measured by using a piezoresistive linear array sensor. The sensor was designed to be able to determine strains in the directions normal and parallel to the surface. Bonding dynamics of Cu and Au balls were investigated. We can clearly observe the oscillating strain according...
Assembly process reliability for Optical Multi-Chip Modules (MCM) is studied and improved. In the optoelectronic (OE) chip assembly for the Optical MCM, the OE chip with Au stud bump is joined with Sn-Ag-Cu (SAC) soldered in a through-waveguide via on an organic substrate to obtain high optical coupling efficiency. Since solid-liquid diffusion of Au to molten SAC is rapid, and formation of brittle...
High-performance computing has been aggressively driving pitch and performance requirements for off-chip interconnections over the last several decades, pushing solder-based interconnections to their limits. The most leading-edge Cu pillar technology faces many fundamental challenges in scaling to pitches below 30um, in particular with stress management and increased risks of Au embrittlement as solder...
Silver (Ag) bond wires are increasingly used in semiconductor components to replace gold (Au) bond wires, and applications for these components are expanding from consumer to high-reliability electronic systems. To assess the impact of this technology transition on the overall component reliability, extended reliability testing beyond the typical JEDEC component qualification testing is needed. Additionally,...
For memory devices, focus has been on Ag alloybonding wire as a low-cost alternative to Au bonding wire. However, Ag bonding wire has lower long-term bond reliabilitythan Au bonding wire under high temperature and humidityconditions. Past research has mainly been concerned withenhancing the bond reliability by Pd doping into the Agbonding wire. On the other hand, Ag-Pd alloy bonding wire haspractical...
We have developed a GPS product to eliminate the enclosure by creating a hollow cavity between active dice and the package substrate. To create the hollow cavity, we use a 2-layer sheet overmold to prevent mold compound encroaching under the dice. Flipped SAW filter and GaAs low noise amplifier (LNA) dice with gold stud bumps are attached to Ultra Low-footprint CSP (ULC) co-fired ceramic substrate...
Flip-chip bonding has become an efficient method to realize fine-pitch interconnection in high density interconnection applications. Thermal-compression bonding of Cu/Sn microbumps can induce extra thermal stress because of high bonding temperature, long bonding time and high bonding force. Temperature, time and force are expected to be decreased to improve the thermal-mechanical reliability of the...
Microbump-based interconnects with 20 µm pitch have been fabricated on 300 mm wafers using industrial tools. Good processes control enables to get narrow standard deviations for the microbumps height (0.2 µm) and diameter (0.4 µm). Assembly was studied with chip to wafer (CtW) test vehicles by either mass reflow (MR) or thermo-compression (TC) with or without non-conductive paste (NCP). MR and TC...
This paper presents the design and implementation of engineered nanoscale bonding interfaces as an effective strategy to improve manufacturability of Cu-Cu bonding to the level where it can, for the first time, be applied to chip-to-substrate (C2S) assembly. All-Cu interconnections are highly sought after to meet the escalating electrical, thermal, and reliability requirements of a wide range of emerging...
The contact resistance (RC) of Au wires bonded to AlCuW bond pads (98.5% Al, 0.5% Cu, 1.0% W) and pure Al bond pads was measured continuously using the high-resolution resistometric method during multiple high-temperature storage (HTS) tests. Oven storage temperatures from 200°C to 250°C were utilized to accelerate the intermetallic formation and resistance degradation at the bond interface. This...
Copper (Cu) wires are increasingly used in semiconductor devices to provide cost-effective packaging. With its excellent electrical properties, copper has higher mechanical properties than gold (Au) wire. Many of the challenges for Cu wire have been and are being evaluated to meet the stringent quality requirements of the automotive industry. In July 2016, the AEC-Q006 Revision-A document was published...
A density staggered cantilever was developed to measure the micron length gravity between itself and an optically levitated microsphere in high vacuum. The cantilever, has two main density contrasted materials gold(19.3g/cm3) and silicon(2.33g/cm3), where each of the material is finger-shaped and stagger placed next to each other, constitute an integral finger array on the device layer of SOI wafer...
Copper/tin thermo-compression bonding technology has been a focus and hot spot of global research institutions for a long time. Inter-diffusion and intermetallic compound (including the metastable η-phase Cu6Sn5 and the stable ε-phase Cu3Sn) formation will occur at the bonding interface during the heating and pressing step of bonding experiments. Considering that tin is easily oxidized and copper/tin...
We developed a method based on cyclic voltammetrically measurements which allows corrosion sensitivity analyzes of typical metallization systems for substrates and electrical contacts in a very short time. Using a new electrolyte with innovative composition enables to combine the aggressive impact of the three standard tests in one procedure and initiates typical application related corrosion processes...
There has been an increasing need of technologies to manufacturing chemical and biological sensors for various applications ranging from environmental monitoring to human health monitoring. Currently, manufacturing of most chemical and biological sensors relies on a variety of standard microfabrication techniques, such as physical vapor deposition and photolithography, and materials such as metals...
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