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Silicon interposer based 2.5D IC can realize heterogeneous integration and is effective to implement an electro-optical system. In this paper, we analyze the CPW structure transmission line on silicon interposer for high speed electro-optical system. The RDL-TSV-RDL transmission structure is used to reduce the resonance. An optimization method is proposed to improve the performance of the RDL-TSV-RDL...
The sensitivities of a Monte Carlo simulation tool (PRESTAGE) to variation of input parameters are studied. When calculating the single event upset cross-section induced by proton direct ionization, PRESTAGE calculation results significantly change with changes in the sensitive volume and passivation layer thicknesses. When calculating cross-sections induced by proton indirect ionizations, PRESTAGE...
TSV (Through-silicon Via) meets the demands of high speed and low power consumption in 3D integrated circuits. However it faces challenge in signal integrity problem such as crosstalk. TSV to TSV coupling is the most significant crosstalk problem in TSV based 3D ICs. This paper presents a quantitative estimation on the TSV to TSV crosstalk induced interconnect delay, trying to find the worst interconnect...
The TSV(Through-Silicon Via) plays an important role of inter-layer interconnection in 3D ICs. However, TSV is defect prone. This paper proposes a new scheme based on oscillator to monitor the defects of TSV at the prebond stage.
This study presents a test scheduling strategy for multi-tower three dimensional (3D) stacked ICs (SICs). Towards the given complete stack, a session-less based test scheduling method is proposed. Experimental results show that the proposed method minimizes the total test time under the constraints of the number of test TSVs and test pins. Besides, it is found out that the 3D-SIC configuration in...
This paper describes selected technologies for the 3D integration of MEMS devices. This comprises a Via Last approach for the formation of MEMS TSVs and a Cu based thermo-compression bonding method for the realization of small 3D-WLP devices. Moreover, the Aerosol Jet technique is discussed as method for the final assembly by means of printing conducting lines over 3D topography.
The pre-bond through silicon via (TSV) probing tests and fault localization are important for yield assurance in 3D-SICs. This paper proposes an optimization algorithm to generate the preferable set of test sessions for pre-bond TSV probing tests. Test sessions generated by the optimization algorithm can not only get localization of faulty TSVs in TSV network, but also reduce test time and cost of...
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