The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
This paper deal with structure for low inductance and high heat operation of silicon carbide (SiC) power module, which attracts attention in terms of high withstand voltage, high efficiency and high heat operation in recent years. First, the parasitic inductance of the power module of two types of structure; a conventional structure which forms the current path in a planar manner and a structure formed...
This paper presents a comparison of Miller clamp implementations for a high-performance SiC MOSFET half-bridge power module. The objective of this work is to demonstrate the optimal location and layout of a Miller clamp to minimize false turn-on behavior under very high-speed switching. Utilization of a Miller clamp exhibits benefits over a standard gate driver configuration, but due to its physical...
Owing to the miniaturization of power electronics and the development of portable and flexible devices, demands for highly thermally conductive, mechanically flexible, and electrically insulating composites have substantially increased. The high thermal conductivity of boron nitride (BN) platelets is expected to endow polymer composites with high thermal conductivity. Whilst BN is a typical two dimensional...
Existence of partial discharge (PD) is one of the key issues in high-voltage power module. Thus, identifying a PD location in a power module leads to a higher voltage operation of a power module. An attempt is made to identify PD location in an IGBT power module by measuring electromagnetic wave (EMW) detected by multiple loop sensors. In this paper, a novel technique for identification of PD source...
This paper presents an Integrated Power Module (IPM) and an Integrated Power Unit (IPU) which are based on the IGBT double sided cooling technology. The IPU can be used as the motor control inverter in the electric vehicle. While the IPM used in the IPU is packaged with latest 650V trench field-stop IGBT device and double sided cooling technology. With the double sided soldering and cooling technology,...
We propose a hybrid control scheme for Single Stage Boost Inverter (SSBI) with reduced number of devices for Photovoltaic (PV) and nanogrid residential applications for both AC and DC loads. When compared to multistage topology, single stage topology is simple with less number of devices and components. The reduction in devices and components results in low cost and better efficiency. The hybrid control...
This paper investigates different thermal management solutions for GaN HEMT mounted on Printed Circuit Board (PCB) substrates. Wide bandgap (WBG) power semiconductors like GaN devices have the ability to operate at high switching-frequency (from few 100 kHz to several MHz). To take advantage of their high frequency switching capabilities, the parasitic inductances of power connections as well as the...
Toggle rate estimation is critical in the area of chip design, as it plays a major role in the power dissipation of a chip. This work presents a method to estimate the net toggle rate of a gate level circuit considering the effects of spatial correlation, temporal correlation and glitches and a comparison with LUT based methods is carried out. Previous works have addressed only on LUT based methods...
Nano-sized magnesium oxide or magnesia has been reported to be useful for suppressing the space charge accumulation when it is added in epoxy resin. However, the addition of nano-magnesia to epoxy resin decreases the glass transition temperature (Tg) signficantly, which may limit industrial applications of magnesia/epoxy nanocomposites. In this work, nanomagnesia particles with an average size of...
This paper introduces a technique for adding two complementary features to power electronics circuits based on multi-chip power modules: high-bandwidth current measurement and ringing suppression. The design of the “CT-snubber” device, which can be viewed as an extension of the traditional current transformer, incorporates an additional filter network which can be tuned to mitigate the undesirable...
Current power electronics devices are unable to realize their full capabilities due to the challenges of standard planar packaging including heat dissipation, reliability and parasitic inductance. This work aims to address all of these challenges simultaneously, thus creating a revolutionary approach to power packaging which significantly improves overall capability. The new approach stacks power...
This paper reviews the challenges and recent advances in packaging that can be utilized for silicon carbide (SiC) power devices. It focuses on the recent progress in three primary areas consisting of: 1) attaches, 2) die interconnections, and 3) advanced heat transfer techniques. Various technologies in each of these areas are discussed and evaluated to define the advantages and disadvantages of each.
This paper evaluates the benefits of replacing the Si diodes of a commercial IGBT module for the main inverter application of an electric vehicle with SiC diodes, leaving the other components of the package and the system unchanged. This will give a direct comparison of Si vs SiC diodes, without giving scope for discrepancies arising out of differences in the packaging, gate-driver circuit etc. The...
This report focuses the current distribution in a module identifiedwith magnetic near-field intensity for optimizing layout and packaging design of silicon carbide (SiC) power module. This measurement methodology can visualize the practical current distribution on a wiring pattern in a module and can estimate the effect of snubber capacitor in a DC-link of half-bridge to suppress the voltage overshoot...
Transient Liquid Phase Sintering (TLPS) is a novel high power density module and high temperature electronics interconnect technology. The copper-tin (Cu-Sn) TLPS system is of particular interest because of its fast process completion, high melting temperature, and low cost. The high thermal conductivity of Cu and Cu-Sn Intermetallic Compounds (IMCs) compared to other metals and IMCs should make it...
The thermal isolation capabilities of fluid cooled via-enhanced glass interposers are investigated with resistive-heater test chips and IR thermography. Previous studies have shown that the degree of thermal coupling between adjacent devices hosted on via-enhanced low conductivity interposers is lower than those on silicon interposers, but at the cost of increased chip-to-ambient thermal resistance...
In typical press-pack, free-floating packages the thermal contact resistance between chip and substrate is a major limiting factor for the cooling ability of the power module. We report an introduction of a new, thin Silver interlayer between Molybdenum substrate and chip, and how it improves the thermal contact. The thermal contact resistances were measured with and without a Silver interlayer at...
A novel high frequency high voltage (HV) generator circuit with air-core transformer is proposed in this paper to achieve high power density packaging structure and compact size advantages. Planar multi-layer printed circuit board(PCB) winding and litz wire wound winding structure are investigated for air-core HV transformer. The electrical design of air-core HV transformer with HV multiplier circuit...
This paper presents the thermo-mechanical reliability analysis of a novel chip-scale wire bondless packaging technique for a SiC Schottky diode that leads to lower parasitics, higher reliability, lower costs, and lower losses. The proposed approach uses a flip-chip solder ball array to make connections to the anode. A copper connector was used to make contact with the bottom cathode, thus reconfiguring...
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.