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For differential-signaling system, the ideal balance or symmetrical topology cannot be established due to bend (turnoff point) discontinuities, and hence, an imbalance component is excited. Therefore methodology and geometrical-structure for satisfying both SI and EMI performances are indispensable. In order to provide basic considerations for the realization of methods for predicting and suppressing...
In response to the requirement of novel crosstalk-reduction scheme for high density through silicon via(TSV) interconnects in silicon interposer, this paper presents a structure and performance analysis of through-silicon via(TSV) with direct ohmic contact between a ground TSV and silicon substrate for coupling mitigation purposes. We further expand the structure to a 3×3 TSV array and investigate...
An effective method s proposed to enhance the SI and PI of a power-bus structure PBS) in a layered medium PCB by suppressing the EMI-causing resonance mode It s implemented by a complementary split-ring-resonator as a 1-cel metamaterial-inspired geometry formed in the PBS to remove the resonance that hinders the signal transfer from one layer to another. The method is verified by the full-wave simulation...
Signal integrity issue has become more and more important in recent years. In order to have a good signal quality, many aspects in a digital channel must be carefully considered. In this paper we compare the effects of non-ideal output driver and different power distribution networks (PDNs) on the signal integrity. The channel performance variation under different driving bit rates is also analyzed...
The impact of passive signal integrity (SI) improvement techniques on the radiated emission (RE) for different interconnections between digital devices is presented. In high speed digital integrated circuits, SI is no longer the only issue for desired functional performance. RE is also critical for the functional performance and for compliance with EMC standards. Hence, it is important to understand...
As new NAND specification such as Toggle 2.0 has been standardized and developed, supply voltage has been reduced from 3.3V to 1.8V because of the adoption of high-speed I/O. Accordingly, due to issues of the backward compatibility with previous specifications and the power budget, voltage regulator implemented in a package should supply the power to the I/Os. In this paper, we propose the advanced...
In this paper, two kinds of compact waveguide structures based on through glass vias (TGVs) technology are proposed. A full-wave simulator on the basis of finite element method is applied to analyze the transmission characteristics of these structures. The return loss S11, transmission S21 and electric field distribution results show that they have the similar signal transmission performance of the...
For actual differential-signaling system, the ideal balance or symmetrical topology cannot be established, and hence, an imbalance component is excited. To provide the basic considerations for establishment of predicting the EM radiation from practical differential-paired lines, this paper attempts to identify the dominant factor of imbalance component and EM radiation from asymmetrical differential-paired...
In this paper, practical test patterns are designed to calculate the characteristics of Through-Silicon Via (TSV) pairs in a silicon interposer. Proposed test patterns include probing pads, traces and TSVs, which are modeled by a combination of impedances and admittances. Performance of the test patterns is obtained from simulation models built in full wave simulation solver. TSV response is then...
Transmission characteristics of a differential line across a ground slot is investigated. The ABCD parameter s for a differential line with a slot n the ground pane are described and an equivalent transmission line model in terms of the effective mode characteristic impedances and the propagation constants is proposed. The validity of the approach is confirmed through comparison with different test...
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