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Microelectromechanical systems (MEMS) technology using “back-end of line” (BEOL) processes for CMOS LSIs (called “BEOL-MEMS” technology hereafter) was developed. BEOL-MEMS makes it possible to monolithically integrate MEMS with LSIs. A pressure sensor is successfully integrated with a CMOS LSI, which shows good mechanical reliability and high output-voltage stability. To demonstrate the potential...
A process sequence has been developed and characterized to fabricate interconnect structures in MEMS devices capable of withstanding thermal cycles up to at least 700°C. Via test structures with 3-7 μm diameter and 5-10 μm depth were etched in thermally oxidized silicon wafers and filled with platinum (Pt). Key enabling process steps were Pt electroplating and Pt CMP as reported herein. Target applications...
The following topics are dealt with: Interconnect Technology; systems and interconnects; process integration; materials and unit process; back end memory and MEMS; reliability and characterization; packaging, 3D and TSV; and novel materials and concept.
In this paper we show that by shrinking MEMS switches to sub-micron thickness and a few microns in lateral dimension, they can be encapsulated in the dielectric spacer between the metallization of a back end CMOS process. By making zero restoring force rocker switches in addition to more traditional cantilever based switches we demonstrate that by coupling several switches together logic functions...
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