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The following topics are dealt with: Interconnect Technology; systems and interconnects; process integration; materials and unit process; back end memory and MEMS; reliability and characterization; packaging, 3D and TSV; and novel materials and concept.
In this paper, two new interconnect technologies designed for integration of a large biosensor array and a signal processing CMOS IC are presented; a TSV technology that can be fabricated in wafers that cannot be aggressively thinned down or have sensitive sensors fabricated in prior processes, and a compliant interconnect technology that enables minimal stress permanent interconnections or low-force...
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