The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
The thermomechanical fatigue of solder joints on the system level is more complex to predict than on the board level. The damage of the solder joints of an electronic device in an ECU (electronic control unit) depends on the thermal expansion mismatch between the materials of the device and the PCB (printed circuit board), so called local mismatch, as well as on the global deformation of the PCB induced...
Behavior of epoxy resin is critical for performance and reliability of electronic packages. The ability to predict properties of cross linked epoxy resin prior to laboratory synthesis will facilitate the materials design. Theoretical studies in this field face a big challenge because there is no conventional way to build atomistic models of specific polymers, which form a network. Molecular dynamics...
The aerospace and high performance (AHP) electronics industry leans henceforth on the technologies developed for consumer applications. However, the requirements of AHP products in terms of reliability are stronger than for consumer ones. One of the factors to improve the reliability in thermal cycling of electronic assemblies is the selection of base materials for Printed Circuit Boards (PCB). In...
Warpage of micro-electronics caused by the curing process and thermal cycling is of major importance in electronic packaging. Industry is availed by good methods to be able to predict warpage accurately. The main difficulty for prediction of warpage is caused by the complicated material behavior of molding compound. It turns out that the mechanical behavior of molding compound is dependent on time,...
The use of temperature and time dependent material parameters is state-of-the-art in mechanical engineering. An advanced measurement method for the determination of moisture dependent parameters for micro and nano scale samples was developed. In combination with FE-analysis, this tool (involving time, temperature, and humidity) ensures a sure deployability. The present paper deals with the influence...
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.