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The migration issue of PackPackage-on-Packageage-on-package (PoP) is investigated in this article. The migration phenomenon can be amplified as the density of solder bumps increases, while the paths are very finer as well in PoP. These migration effects were first evaluated by three dimensional finite element simulations in ANSYS in a previous article, in which the bottom of the bump was found out...
Two new designs for copper base heat sink is proposed in this work. In some experimental and numerical simulation efforts, optimizing and predicting of the thermal characterization of the heat sink with inclined free fins is developed.
It is well known that high temperature storage can degrade wire bonding contacts significantly due to interdiffusion of pad metal and bonding wire. Looking at harsh applications such as engine management we notice an additional failure mode caused by the temperature gradient during the pulsed active cycling period. Especially when we aim at components with high temperature capability and we substitute...
Environmental test is widely used to verify the adaptability and reliability of various electronic products in the last decades. The sharp change of temperature and humidity in certain situations could pose a serious reliability issue on the electronic components. This paper presents an experimental study of one kind of plastic substrate based flexible display called STN (super-twisted nematic). The...
The numerical pre-design of a novel micro-machined thermal infrared emitter, using a spider type hotplate concept is presented. The spider concept introduced allows the fast transient operation of the emitter and thus a direct modulation of the radiation without additional mechanical tools like choppers. The thermal radiation source is excited by a pulsed electrical voltage and is thermally separated...
The paper discusses the increasing need for a more sophisticated thermal characterisation of LEDs (Light Emitting Diodes) and LED-based products. It goes without saying that the LED-business is growing exponentially, in fact, much faster than analysts predicted five years ago. Unfortunately, the progress in thermal characterisation has not kept pace. The situation is becoming a serious problem for...
This paper presents the model for the design optimization of an aluminum Thermal Linear Motor (TLM) for high bandwidth positioning systems. The aluminum TLM is the crucial driving element for our Hard Disk Drive thermal micro actuator. It occupies less area than an electrostatic actuator with the same driving force while still reaching 3-5 kHz bandwidth for positioning accuracy better than 5 nm. Optimized...
This paper presents a combined numerical and experimental methodology for predicting moisture-induced effects in Package-on-Package (PoP) assemblies. The hygroscopic warpage of the assembly "PoP" is measured. Its behavior is compared with the individual components "top" and "bottom". The assembly "PoP" absorbs more moisture than the sum of the two individual...
In this study, two highly filled molding compounds were used as example to demonstrate the characterization scheme. In addition, two low filled packaging polymers are included for comparison. The characterization scheme consists of the steps sample preparation, measurement of the material data, and modeling the material behavior. The dasiasample preparationpsila step included a DSC analysis to understand...
This paper investigates a method to decide which mechanical modes need to be retained in a modal truncation for a thermomechanical problem. A more efficient reduction basis is formed by looking into more detail in the modal participation of the different mechanical modes. Based on the spatial matching properties of mechanical modes with thermal modes can be decided which modes need to be retained...
In this paper we present a novel approach to determine material thermal properties of thin film materials. As a test case we have chosen silicon nitride employed in a micro-hotplate structure. We use ANSYS to build a three-dimensional finite element (FE) model of the test structure, which considers heat conduction and convection effects. It is further parameterized and subjected to parametric model...
Calibrated 3-D numerical simulations are employed to quantify the influence of design parameters like emitter area, aspect ratio, distance to trenches, and thickness of AlN heatspreaders on the thermal transient behavior of silicon-on-glass (SOG) bipolar transistors. A larger silicon island enclosed in the trenches reduces the thermal resistance at the expense of a slower thermal response of the system...
Flexible substrates (polymers) for plastic electronic products are far less stable to environmental factors, like heat and moisture, than currently used non-flexible substrates (silicon). This introduces problems during the lithography process of these products. This study presents a thermo-mechanical model of PEN foil; an organic material often used as flexible substrate for plastic electronics....
Failure analysis in complex integrated microelectronic devices is of increasing importance to improve their reliability, quality, and manufacturing yield. Non-destructive testing methods for localisation of shorts and opens in the internal circuitry are required, particularly for complex and fully packaged devices. The method of lock-in thermography (LIT) was developed for localisation of electrically...
An enhanced smart flow sensor is being developed at IMTEK in order to measure both flow and thermal properties of fluids at the same time. To be able to measure the thermal properties of a fluid, a sinusoidal voltage is applied at heater. This results in a time-dependent temperature response on a thermistor array. Amplitudes of the temperature signals on the thermistors, and thus the maximum sensitivity...
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