The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
In this paper, a methodology is proposed for expediting the coupled electro-mechanical two-dimensional finite element modeling of electrostatically-actuated MEMS. The proposed methodology eliminates the need for repeated finite element meshing and subsequent electrostatic modeling of the device during mechanical deformation. With the reference domain defined to be the device geometry in the absence...
This paper proposes a parametric simulation plan for UBM geometry with different UBM rim angles, diameters and thicknesses. The parameter plan for the solder bump with different heights and diameters, and different shapes is also investigated. The goal of this study is to understand the impact of the die shrinkage on solder joint reliability under electromigration failure, and to optimize the UBM...
Stretchable electronics offer potential application areas in biological implants interacting with human tissue. Furthermore, they facilitate increased design freedom of electronic products. Typical applications can be found in healthcare, wellness and functional clothes. A key requirement on these products is the ability to withstand large deformations during usage without losing their integrity (i...
Modelling of MEMS is one of the difficulties faced in advancing the design. The parameters fed to the simulator consist of the material properties and the geometry of the structure. Material wise, researchers are working on developing precise characterisation techniques to ameliorate the mechanical definition of structural material used. More work is now ongoing to ameliorate the fabrication process...
In this paper we discuss the influence of solder joint geometry on the lifetime of a flip chip assembly. Geometry variations caused by variations of solder volume, pad configuration, and pad size on the printed circuit board (PCB) were taken into account. Typically these parameters vary due to technological fabrication tolerances. Consequently, the influence of such design aspects on system reliability...
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.