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The thermomechanical fatigue of solder joints on the system level is more complex to predict than on the board level. The damage of the solder joints of an electronic device in an ECU (electronic control unit) depends on the thermal expansion mismatch between the materials of the device and the PCB (printed circuit board), so called local mismatch, as well as on the global deformation of the PCB induced...
Considerable scientific efforts were made in the past decade, to come up with reliable and predictive analyses for lead-free solder interconnects, in view of their obligatory introduction a few years ago. This paper concentrates on a number of physical, computational and experimental multi-scale aspects, based on the analyses of the instabilities that occur in a Sn-Ag-Cu (SAC) alloy. Particular attention...
Reliability of SnAgCu solder joints under mechanical stress is not proven, in particular for Aeronautic and High Performance (AHP) products. They are subjected to high temperatures, severe mechanical stresses and long-term mission profiles. This work is comprehended within a larger study, which has as objective the characterization of the SnAgCu alloys mechanical behaviour at the solder joint scale...
The paper reports the results of a systematic improvement project on the thermal cycle (TC) lifetime prediction of BGA memory modules with SnAg1.0Cu0.5 and SnAg1.0Cu0.5Ni0.05 solder alloys. The pre-existing lifetime modeling scheme allowed predictions with an inaccuracy factor of about 1.6plusmn1 on average while in TC experiments, the characteristic lifetime, N63, showed a standard deviation of about...
Due to environmental consciousness and legislative regulations, Pb-free solders have been increasingly used for replacement of conventional SnPb solders in the microelectronic industry. However, during the transition period from SnPb to Pb-free solders, some products will potentially consist of mixtures of Pb-free with SnPb solders. This paper presents the results of microstructural analysis of mixed...
The simulation results show that larger contact opening may not benefit on relieving current crowding effect in the flip-chip solder joints. For the solder joints with a 10-mum thick Cu UBM, the diameter of the contact opening for the lowest current crowding effect is 60 mum. It means that using larger or smaller diameter will increase the current density in the solder bumps. In addition, the optima...
A continuum damage model is proposed for Sn3.0Ag0.5Cu solder alloy in pure shear conditions. Experimental tests were performed on specific torsion samples to adjust material parameters of the continuum damage model. The main advantage of this method is to introduce damage process in the mechanical behaviour law of SnAgCu solder. Damage process highly affects the mechanical behaviour of solder alloy...
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