The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
Thermal cycling accelerated life testing is often used to qualify area array packages (e.g. Ball Grid Arrays and Flip Chip) for various applications. Finite element life predictions for thermal cycling configurations are challenging due to the complicated temperature/time dependent constitutive relations and failure criteria needed for solders and encapsulants and their interfaces, aging/evolving...
The interfacial failure behavior of a single solder joint is investigated under the pure tensile or shear loading at 5 mm/s. The brittel failure is detected for the specimen under pure tension loading, while a ductile failure is found after pure shear loading. A cohesive zone model is employed herein to explore the dynamic fracture behavior at the solder/IMC and IMC/Cu pad interfaces. The simulated...
Through an aggressive product development program which includes experiment and simulation, Amkor has developed the next level of WLCSP (CSPnltrade), a product which exhibits superior board level reliability when subjected to drop impact, a strong requirement for portable electronics. Failure mechanism of WLCSP under drop test has been established. Depending on type of WLCSP and test board design,...
Since many years, the University of Liege is involved in micro-electronics and micro-electromechanical systems modelling, design and integration. Recently, the University of Liege had received the opportunity to build a brand new infrastructure (clean rooms - ISO 7) with specific equipments for packaging and MEMS characterisation. This new facility (clean rooms and equipments) enables the University...
Nanotechnology has come to mean any item smaller than microtechnology, including nano powders, carbon nanotubes or other items. The field deals with manipulating atoms and molecules to create materials and devices. Carbon nanotubes (CNTs) had been shown to possess extraordinary optical, electrical, thermal and mechanical properties and it is believed that they have the potential to significantly impact...
In this paper the potential of molecular dynamics simulation for structure-property correlations in epoxy-resins is discussed. This is a topic relevant for a multi-scale framework to lifetime prediction in microelectronics packaging. To achieve that objective, epoxy-resins are synthesised by systematically varying their chemical structure and then characterised by various thermo-mechanical testing...
The through silicon interconnection technology for stacked dies is a promising way of future package construction as it lowers yield risks of large die sizes and allows cost effective packaging solutions for heterogeneous electronic systems. Thermo-mechanical reliability dependent on processing and mounting steps as well as during testing are one major concern, which was addressed by FEA. The numerical...
Since lead was banned from the solder joints, mechanical tests of microelectronic components and modules have gained much importance not just in mobile electronics but quite in general. The standardized JEDEC drop test is commonly used. It delivers repeatable results for a wide range of loads in the components mounted on the well specified test PCB. As yet the JEDEC drop test is time consuming and...
In the design process, modelling is a fundamental stage which allows the designer to obtain a general overview of the device performance. Very often, this phase is very time-consuming, especially if a well optimized device which fulfils very specific requirements is to be fabricated. Hence, a fast and reliable technique of simulation is needed and accurate tools have to be used to achieve this goal...
There are many optimization algorithms, which can be used to find the extremum of a function. However, in optimizing the function, which is obtained from the numerical calculations, it is necessary to apply the proper global optimization algorithm. It is caused by the high nonlinearity of the numerical function's response. The nonlinear function with not known analytical form may have many local extrema...
The thermomechanical fatigue of solder joints on the system level is more complex to predict than on the board level. The damage of the solder joints of an electronic device in an ECU (electronic control unit) depends on the thermal expansion mismatch between the materials of the device and the PCB (printed circuit board), so called local mismatch, as well as on the global deformation of the PCB induced...
Microelectromechanical systems (MEMS) are intensively studied since many years due to their high potential performances and their integration possibilities. In particular, electromechanical resonators realized at the CMOS level could allow the emergence of integrated multi-frequency architectures suitable for future multiband wireless communication devices that might require many reference frequencies...
Interfacial adhesion between the Epoxy Molding Compound (EMC) and the copper-based leadframe is one of the major concerns in the qualification of plastic packages. Since the conventional shear testing methods used in industry do not consider the residual stresses in the shear samples, they are only used as a qualitative testing method for the EMC qualifications. However, since these tests are based...
In this paper, a methodology is proposed for expediting the coupled electro-mechanical two-dimensional finite element modeling of electrostatically-actuated MEMS. The proposed methodology eliminates the need for repeated finite element meshing and subsequent electrostatic modeling of the device during mechanical deformation. With the reference domain defined to be the device geometry in the absence...
As the electronic industry is making its progress to miniaturize high performance, smaller and lower-priced IC packages, 3D packaging technologies are presently used to achieve these goals. Although 3D packaging technologies are vastly studied and applied to perform better performance, low power consumption and smaller packaging size of IC packages, thermo-mechanical problems occur as well due to...
The board level drop test is intended to evaluate and compare the drop performance of surface mount electronic components. The JEDEC standardize for board level drop test address test board construction, design, material, component locations and test conditions etc. However, in actual drop test conditions, continued drops usually loosen up the mounting screw, which is not considered in JEDEC. This...
One of the driving factors for a steady reduction in wafer and cell thickness is the present shortage of polysilicon feedstock combined with the need to reduce manufacturing costs in photovoltaic module production. Therefore materials and manufacturing processes must adapt to maintain acceptable mechanical yields and module reliability. The soldering of solar cell strings is a critical step in the...
The migration issue of PackPackage-on-Packageage-on-package (PoP) is investigated in this article. The migration phenomenon can be amplified as the density of solder bumps increases, while the paths are very finer as well in PoP. These migration effects were first evaluated by three dimensional finite element simulations in ANSYS in a previous article, in which the bottom of the bump was found out...
A set of experimental and computer simulation methods has been applied to reliability analysis of a newly designed resin transfer molded power electronics module for automotive applications, comprising the glass-fiber epoxy multi-layer PCB, populated with various electronic packages. Evaluation of thermo-mechanical stability, determination of moisture ingress, and testing the adhesion quality between...
Power electronics uses semiconductor technology the convert and transmit energy. Power electronics modules such are the core electronic packages that undertake this function. The take up of these technologies is growing dramatically due to the increase in electronics in sectors such as automobiles, aerospace, consumer white goods, and of course green technologies. Designing such modules requires a...
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.