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This paper provides a technical perspective and review of water cooling technology as implemented through 5 generations of IBM's high performance computing systems from the S360/91 to the recently announced IBM Power 575 supercomputing system. The use of hybrid air-to-water cooling and then indirect (cold plate) water cooling in earlier IBM systems is described. Attention is given to how and why water-cooling...
A novel vapor chamber is proposed and tested in this study. Multi-layer copper mesh is sintered to the inner surface of the bottom plate as the evaporator wick. Parallel channels, with inter-channel openings, are made on the inner surface of the top plate. The peaks of the channel walls directly contact with the wick so that the channels function as vapor path, condenser and structural supporters...
To meet electrical performance requirements, the industry is implementing ultra-low dielectric constant (ULK) materials in the back end of line interconnect structure. ULK dielectrics are inherently weak compared to traditional dielectrics and pose significant challenges to electronic packaging processes and reliability. Accurate mechanical properties are a prerequisite for upfront risk assessments...
The merits of water-fed microchannel heat sinks have shown that the technology may be a plausible and effective cooling solution for the ever-increasing power dissipation of high speed microprocessors. Favorable factors such as high heat transfer surface area and heat flux removal for reasonable operating pressures, as well small heat sink mass and volume continue to drive the technology. However,...
As the increase of power densities became the primary constraint for semiconductor industry to sustain the Moore's law for microprocessor evolution, multi-core architecture has been introduced in order to meet the growing demands for performance. Non-uniform power distribution, increased die-size and multiple-chip packaging present new challenges for the thermal management of modern CPUs. Further...
Spatial frequency domain (SFD) analyses of heat transfer along with the spatially-resolved imaging of microprocessor power (SIMP) method have provided a deeper understanding of the thermal behavior of microprocessors. In the present work, the thermal transfer function of a convectively cooled chip is written as a summation of functions with known Hankel transform pairs. Subsequently, the impulse response...
Driven by shrinking feature sizes, microprocessor "hot-spots" - with their associated high heat flux and sharp temperature gradients - have emerged as the primary "driver" for on-chip thermal management of today's advanced IC technology. Proposed uses of solid state thermoelectric microcoolers for hot spot remediation have included the formation of a superlattice layer on the back...
Integrating microchannels at the thermal interfaces of heat sinks, spreaders, and microprocessor chips can reduce bond line thickness, assembly pressure, and overall thermal resistance. The channels help control the flow of particle-filled thermal interface materials (TIM) during the assembly squeeze but the relationship between channel geometry, material properties, and interfacial area is not fully...
An air cooled loop heat pipe (LHP) system was developed for cooling a dual CPU 1U server. The LHP uses newly developed flat plate evaporators and air cooled condensers with millimeter scale condensation channels and plain parallel fins. Bench tests were conducted using 20 x 20 mm uniform heat sources dissipating 100 watts and air preheating to simulate air-cooled operation within a 1U server chassis...
Microprocessors continue to grow in capabilities, complexity and performance. Microprocessors typically integrate functional components such as logic and level two (L2) cache memory in their architecture. This functional integration of logic and memory results in improved performance of the microprocessor. However, the integration also introduces a layer of complexity in the thermal design and management...
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