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The wafer level package (WLP) is a cost-effective solution for the electronic package, and has been increasingly applied during recent years. In this study, a new packaging technology developed based on the concepts of the WLP, the panel base package (PBP) technology, is proposed in order to further obtain the capability of signals fan-out for the fine-pitched integrated circuit (IC). In the PBP,...
Piezoresistive stress sensors are considered to be a powerful tool for experimental stress analysis of electronic packages. The stress sensors are fabricated into the surface of the chip and thus, they are an integral part of the chip to be studied. The chip stresses result in resistance changes in the sensors due to the piezoresistance effect that can be measured. Therefore, the sensors are capable...
Sintered nanoscale silver paste was used as thermal interface material in an electronic package. Based on the microstructure of the sintered silver paste, die shear stress-strain curves and thermal cycling test results, a model combined with the model of Navarro-de los Rios and small cracks interaction physical model is put forward to predict the thermal fatigue lifetime of the sintered nanoscale...
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