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This paper demonstrates a low cost MEMS variable optical attenuator (VOA) with high performance for the wavelength division multiplexed (WDM) applications. Two single-mode fibers (SMFs) are used as the input and output of VOA. A shutter is actuated into the optical path by an electrostatic comb-type actuator. The device is fabricated on a single silicon wafer by a novel simple bulk-silicon micromachining...
In this paper, a novel silicon micromachining using CO2 laser has been demonstrated for the first time. The wavelength of CO2 laser is 10.64 mum and not absorbed by silicon material. So, it cannot do any micromachining for pure silicon. However, as we put a silicon on the top of a glass material, CO2 laser can etch the silicon, even etch through the wafer to be a hole structure. For example, a silicon...
Due to the trade secrets and intellectual property, there are still many aspects of MEMS switches which are not understand well and are currently under investigation. In this paper, our report shows that MEMS can be released using O2 and a little carbon powder at the same time. The relationship between the removing polyimide time and the cure temperature is presented using carbon powder in the quartz...
This paper presents the fabrication of a micro droplet ejector for the application of digital printing system. The ejector makes the ink droplets of approximately 80 squaremum diameter on demand. The ejecting system is the type of face-shooter. The method of actuating membrane is bending mode using d31 of PZT. The size of ejector is 27.6 mm x 27.75 mm x 1.1 mm, and the pitch between nozzles is 2.54...
Macroporous silicon technology is an important method to fabricate microchannels on silicon. The formation of insulator layer on the sidewall of the channels is necessary for electrical isolation or passivation of the surface. Oxidation is one of the preferred options. In this paper we investigate the effect of various oxidation processes on the smoothness of the sidewalls of the high aspect ratio...
A new method for realization of 3D multilayer micro structures is presented in this paper. It consists of two major processes: silicon etching process and UV-LIGA process. In this way, some shape limitations of single technology can be overcome for new functions. By combining these processes, multilayer structures and complex graphics can be fabricated. To make good combination, the adhesive characteristics...
Optimization of drug delivery through human skin is important in modern therapy, and with the invention of painless microneedles makes it become true. This paper presents a novel fabrication process for a tapered hollow metallic needles array using nickel plating on the silicon microneedles molds. The silicon microneedles molds, with a shank height of 150-200 mum and 300 mum center-to-center spacing...
A method to fabricate optical fiber probe nanotips by combination of heated micropulling and static chemical etching has been developed. Firstly, electric arc heating and micropulling process is used to change the configuration of fiber cladding, thus to obtain semi-finished fiber probes with desirable shape. Then the dimension of probe tip is further reduced by hydrofluoric (HF) acid static chemical...
In this paper, a self-aligned SiGe/Si HBT was fabricated based on dry/wet etching, in which Si and SiGe materials were etched by KOH (potassium hydroxide) solution and SF6 (sulfur hexafluoride). In the terms of mesa SiGe HBT production, it is a key technology to control the etch of ultra-thin Si and SiGe film. When N+/N silicon in emitter region is etched, the length of etch time is critical. If etch...
In view of micro fuel cells, the silicon processes are employed for microfabrication of the micro direct methanol fuel cell (muDMFC). Using the MEMS technology we have successfully made single muDMFC as small as 8mmtimes8mmtimes3mm. The main reason for the use of MEMS processes is the prospective potential for miniaturization and economical mass production of small fuel cells. The double side deep...
In this paper, we provide monolithic MEMS SoC design examples by adopting high-end standard foundry processes, which would be mostly important for speeding up developments on many MEMS system applications. We have demonstrated array-type structure designs, with sensing circuit includes modulation, amplification, and filtering functions, are fabricated monolithically in a 0.35 μm Bipolar/CMOS/DMOS...
In this paper, a MEMS method is developed to form suspended nano beams in 10 nm order width and thickness. The dimension of the nano beams is controlled precisely by employing traditional anisotropic self stopping etching instead of popular nano fabrication method such as e-beam lithography, which presents an opportunity for the future low cost batch product. The I-V measurements indicate that the...
A new microactuator design was fabricated to make a qualitative researcher on the PZT (Pb(Zr,Ti)O3) piezoelectric thin film. A novel V type valve geometry structure enables fluid pumping. The PZT thin films were used to fabricate multi-layer driving membrane for microactuator by its piezoelectric response. As the key technology of driving membrane, the Si /SiO2/Ti /Au /PZT/Cr/Au multi-layer film preparation...
The photonic properties of the silicon-on-glass (SOG) nano-films are analyzed first and the reason why SOG nano-films are required for the nanophotonics is pointed. Then the method to fabricate silicon-on-glass nano-film materials for the applications of nano photonics is established. Anodic boning and selective etching are employed. SOG-based nano-films are then studied.
This paper describes a micro thermal shear stress sensor with a cavity underneath, based on novel micro bumps on the silicon substrate and sacrificial layer. The micro thermal shear stress sensor has been designed and fabricated by micromachining technology. A poly-silicon strip, 4 mum times 200 mum, is deposited on the top of a thin silicon nitride diaphragm and functioned as the thermal sensor element...
In this paper, we propose a novel method to fabricate three-dimensional hexagonal-like fillister structures on lang110rang silicon wafer by precise bulk etching in micro electro mechanical systems (MEMS). Photo mask is designed as a 50 times 50 array of equilateral parallelograms having side length of 80 mum. The 40 wt% KOH solution is used as the etchant. The created structure is used as the mold...
Piezoelectric resonators have widely been utilized not only for time keeping devices but also for temperature measurement sensors. In order to obtain a temperature sensor having low power consumption, low cost, fast response, high sensitivity and high precision, resonance frequency of quartz tuning fork crystal for use in temperature sensor was analyzed by the finite element method (FEM). FEM was...
Silicon carbide (SiC) is a promising material for the device operating in hash environment, such as high temperature, high pressure or erodent environment, owning to its excellent electrical, mechanical, and chemical properties. The PECVD process allows deposition of SiC at low temperature (200degC-400degC), which makes SiC has better compatibility in Post-CMOS processes. In this paper, PECVD SiC...
In order to further understand behavior of laser-induced electrochemical etching process, laser electrochemical etching metal heated rapidly by laser in the electrolyte was investigated, both experimentally and theoretically. For the first time, 808 nm semiconductor laser was adopted for the process with the stainless-steel sample in sodium nitrate solution. Thermal phenomena adjacent to the metal-liquid...
A new process for self-aligned double gate MOS fabrication is proposed. The milestone of this process in the revelation of a buried mask in the BOX of a SOI wafer and in a thermal oxide layer on top of active silicon film. The revelation of the buried mask makes use of the highly selective etching of implanted oxide in VHF. The etching mechanism of VHF etching of oxide is presented and the influence...
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