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Sensor arrays for the measurement of the load condition of polyethylene spacers in the total knee arthroplasty (TKA) prosthesis have been developed. Arrays of capacitive sensors are used to determine the three-dimensional strain within the polyethylene prosthesis component. Data from these sensors can be used to give researchers better understanding of component motion, loading, and wear phenomena...
This paper reports the design, fabrication and simulation of a novel array of micromachined electrodes with different lengths for use in auditory nerve prostheses. A 10times10 array is created in a 1 mm 2 on silicon with bulk micromachining technology. The electrode lengths vary from 200 mum to 400 mum. This design could provide access to most fascicles within the auditory nerve and thus allow stimulation...
This paper describes microassembly techniques for an out-of-plane three-dimensional microelectrode array for neural stimulating and recording in the central nervous system. An interlocking mechanism has been introduced into the microassembly components to facilitate the process, increase the robustness of the assembled device and improve the yield of the overall system. In-vivo testing has demonstrated...
This paper reports the design, fabrication and simulation of a novel array of micromachined electrodes with different lengths for use in auditory nerve prostheses. A 10times10 array is created in a 1 mm 2 on silicon with bulk micromachining technology. The electrode lengths vary from 200 mum to 400 mum. This design could provide access to most fascicles within the auditory nerve and thus allow stimulation...
Sensor arrays for the measurement of the load condition of polyethylene spacers in the total knee arthroplasty (TKA) prosthesis have been developed. Arrays of capacitive sensors are used to determine the three-dimensional strain within the polyethylene prosthesis component. Data from these sensors can be used to give researchers better understanding of component motion, loading, and wear phenomena...
This paper describes microassembly techniques for an out-of-plane three-dimensional microelectrode array for neural stimulating and recording in the central nervous system. An interlocking mechanism has been introduced into the microassembly components to facilitate the process, increase the robustness of the assembled device and improve the yield of the overall system. In-vivo testing has demonstrated...
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