The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
As semiconductor process technology rapidly develops into deep-sub-micron or nanometer regime, the feature size of semiconductor devices continues to shrink down. As a result, the defect being able to cause a device malfunction is also becoming smaller and smaller, and even certain defect is invisible with high-resolution SEM or TEM. It makes conventional physical failure analysis (PFA) face a great...
End customer in circuit test rejects at a rate of 2-5% was sent back to manufacturer for analysis and inspection. Electrical failure analysis had revealed some leakage on particular pin not included in the production test program. Physical failure analysis on those parts revealed micro-crack on affected pins. The micro cracks were found to be within the bonding vicinity and shown to have been propagating...
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.