The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
This paper employed the Bodner-Partom model to simulate the stress-strain relationship of the Sn-0.7Cu lead-free solder. The model has only five material constants which can be achieved by the tension test. Tension tests with different strain rates and cyclic tests with six different load paths were performed on a minitype tension-torsional testing machine. The simulations have shown that the model is precise enough to reflect the rate-dependence and to calculate the stable cyclic stress-strain relationship under different load paths