In this work a theoretical concept and simulations are presented for a novel lateral drift-field photodetector pixel to be fabricated in a 0.35μm CMOS process. The proposed pixel consists of a specially designed n-well with a non-uniform lateral doping profile that follows a square-root spatial dependence. “Buried" MOS capacitor-based collection-gate, a transfer-gate, and an n-type MOSFET source/drain n + floating-diffusion serve to realize a non-destructive readout. The pixel readout is performed using an in-pixel source-follower pixel buffer configuration followed by an output amplifier featuring correlated double-sampling. The concentration gradient formed in the n-well employs a single extra implantation step in the 0.35μm CMOS process mentioned and requires only a single extra mask. It generates an electrostatic potential gradient, i.e. a lateral drift-field, in the photoactive area of the pixel which enables high charge transfer speed and low image-lag. According to the simulation results presented, charge transfer times of less than 3ns are to be expected.