In this work, electroplating of tin in sulphuric acid is analysed by combining electrochemical impedance spectroscopy, cyclic voltammetry and an electrochemical quartz crystal microbalance.Different processes were identified in the cyclic voltammograms. Two current peaks appear in the cathodic potential scan while the anodic scan shows three current peaks; two of these have associated shoulders. All peaks are associated to mass changes. The mass deposited is, according to the Sauerbrey equation, in good correlation with that calculated by Faraday's law assuming that Sn2+/Sn is the dominant process. Furthermore, the shoulder present in the anodic scan, is associated with the Sn2+/Sn4+ process, as evidenced by charge involved without associated mass changes.Two different electroplated morphologies were identified, which show two peaks in the anodic scan.The presence of additives, a surfactant and a phenolic derivative, favours the tin deposition process to produce smooth planar surfaces.
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CV, EIS and EQCM as in situ techniques were used to study Sn redox processes in H2SO4.
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XRD allows identifying specific electrodeposit morphologies for specific experimental conditions.
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The combination of a surfactant and a phenolic derivative improves the tin deposition morphology.
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In situ EIS allows identifying the role of additives in the control of tin electrodeposition reaction.