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Zirconia (3Y-PSZ) and titanium were joined by active brazing in vacuum with the 63 Ag–35.25 Cu–1.75 Ti (wt.%) filler at 840–870 °C under different contact loads. Brazing conditions did not affect noticeably the joint mechanical strength but a remarkable change of the interlayer microstructure was found. This microstructure evolution affected the fracture behavior: ductile fracture through the Ag-rich...
The oxygen content is usually difficult to control in direct bonding copper process. In this study a new method for preparation of direct bonding copper on alumina ceramic substrates was realized. 96% Al 2 O 3 ceramic substrates were first oxidized by pasting a thin layer of Cu 2 O and firing at 1150 °C in air. Then copper foil was bonded to the substrate by heating to 1070 °C...
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