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In this study, using several types of acidic ionic liquids as the leaching reagents, the leaching behaviors of the copper present in waste printed circuit boards (WPCBs) were investigated. The effects of various parameters on the copper leaching rate were studied, such as the particle size of the shredded WPCB, type of ionic liquid used, hydrogen peroxide dosage, solid-to-liquid ratio, leaching temperature,...
The recovery of copper, nickel, zinc, silicon, iron, aluminum, tin and fluoride ions from fluoride leach liquors of non-ground printed circuit boards (PCBs) from mobile phones is described in detail. These PCBs were leached with HF + H2O2 mixtures after previous treatment with 6 mol L−1 NaOH (removal of the solder mask). A combination of solvent extraction (SX) and precipitation techniques was used...
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