Elektronika : konstrukcje, technologie, zastosowania > 2021 > Vol. 62, nr 5 > 29--37
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journal ISSN : | 0033-2089 |
journal e-ISSN : | 2449-9528 |
DOI | 10.15199/13.2021.4.6 |
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Bibliography
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[1] Tadayon P. (2020) “Moore’s Law and the Future of Test” IEEE SWTW, San Diego.
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[2] Slessor M. (2020) “Probe in the Spotlight Enabling advanced packaging, chiplets, and heterogenous integration”, IEEE SWTW, San Diego.
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[3] Bertarelli E. (2019) “High-end, high-power devices: an integrated solution at probe card level”, IEEE SWTW, San Diego.