Przegląd Elektrotechniczny > 2019 > R. 95, nr 11 > 5--7
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journal ISSN : | 0033-2097 |
journal e-ISSN : | 2449-9544 |
DOI | 10.15199/48.2019.11.02 |
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Bibliography
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[1] Chang T-Ch, Chang J-Y., Chung T-H. and W-Ch.Lo, Dualphase solid-liquid interdiffusion bonding, a solution for the die attachment of WBG, IEEE (2012), 978-1-4673-4944-4
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[2] Larson A., Tolleefsen T.A., Liquid Solid Diffusion (LSD) Bonding, IMAPS/EMPC 2017 Conf. Proc. Warsaw, Poland
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[3] Kisiel R., Mysliwiec M., Solid-Liquid Interdiffusion Bonding Based on Au-Sn Intermetallic for High Temperature Applications, 41st International Spring Seminar on Electronics Technology Conf. Proc. ISSE, Zlatibor (2018), 1-5