The article presents the study results of Sn-Zn lead-free solders with the various Zn content. The results concern the hypoeutectic, eutectic and hypereutectic alloys containing respectively 4.5% Zn, 9% Zn and 13.5% Zn. Moreover, these alloys contain the constant Ag (1%) addition. The aim of the study was to determine the microstructural conditionings of their fatigue life. In particular it was focused on answer the question what meaning can be assigned to the Ag addition in the chemical composition of binary Sn-Zn alloys. The research includes a qualitative and quantitative assessments of the alloy microstructures, that have been carried out in the field of light microscopy (LM). In order to determine some geometrical parameters of the microstructure of alloys the combinatorial method based on the phase quanta theory was applied. Moreover, for the identification necessities the chemical analyses in the micro-areas by SEM/EDS technics were also performed. Based on the SEM/EDS results the phases and intermetallic compounds existing in the examined lead-free solders were identified. The mechanical characteristics were determined by means of the modified low cycle test (MLCF). Based on this method and on the results obtained every time from only one sample the dozen of essential mechanical parameters were evaluated. The research results were the basis of analyzes concerning the effects of microstructural geometrical parameters of lead-free alloys studied on their fatigue life at ambient temperature.
 Liang Zhang, Song-bai Xue, Li-li Gao, Zhong Sheng, Huan Ye, Zheng-xiang Xiao, Guang Zeng, Yan Chen & Sheng-lin Yu. (2010). Development of Sn-Zn lead-free solders bearing alloying elements. Journal of Materials Science: Materials in Electronics. 21, 1-15.
 Kudyba, A. (2016). Perspectives and directions for the development of new-generation lead-free solder and the possibility of their application in lead-free solder technology of consumer electronics. Prace Instytutu Odlewnictwa/Transactions of Foundry Research Institute. LVI(3), 233-260. (in Polish).
 Song, J.M., Lan, G.F., Lui, T.S. & Chen, L.H. (2003). Microstructure and tensile properties of Sn–9Zn–xAg lead-free solder alloys. Scripta Materialia. 48, 1047-1051.
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