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The market of Connectivity, Internet of Things (IoT), Wearable and Smart industrial applications leads Fan Out Wafer Level Package (FOWLP) technologies to a promising solution to overcome the limitation of conventional wafer level package, flip chip package and wire bonding package in terms of the solution of low cost, high performance and smaller form factor packaging. Moreover, FOWLP technology...
This paper presents a novel quasi-Yagi antenna (QYA) design in which the conventional PEC reflectors are replaced by metaedges, one-dimensional artificial perfect-magnetic-conductor-like edges. The unique reflection property of the metaedge helps miniaturize overall dimensions of the QYAs while maintaining high-gain performances. We demonstrate that the separation between the radiators and the reflectors...
Rectangular patch antennas are modeled using arbitrarily oriented biaxially anisotropic substrates. The Method of Moments is used to compute induced currents and the results are used to calculate input impedance, resonant length, impedance bandwidth and radiation patterns. We show that the biaxial anisotropy and orientation of the medium affect performance metrics.
The bandwidth for high performance networking switches and routers increases two to ten times in every new generation. This in turn drives the bandwidth requirements for the Application Specific Integrated Circuits (ASICs) and their external memory devices designed for the high performance network systems. 3D IC integration with its low power, high density and high bandwidth advantages is proposed...
Raman Spectroscopy is a mean to study the molecular structure property of solid, liquid and gases from its scattering spectrum. It offers a detailed biochemical fingerprint for identifying the unknown molecule. Since the amount of inelastic scattering is infinitesimally small relative to that of the elastic scattering, the Raman signal emitted is extremely weak, rendering limited applications. Surface...
Hybrid photovoltaic (HPV) cells were developed onto a flexible microlens array (MLA) in order to improve their efficiencies. The active layer of the developed HPVs was composed of blend of organic PV materials and heavy metal-free CuInS2 quantum dots. The polymer MLA, which was replicated from isotropically etched quartz, was employed for a flexible substrate simultaneously dispersing the incident...
Summary form only given. Lightweight and optically transparent microcavity plasma devices have been fabricated on plastic substrates by replica molding techniques. Polymer-based replica molding processing enables precisely controlled fabrication of complex arrays in an inexpensive, transparent, and flexible substrate that is both disposable and recyclable.Each microplasma cavity has cross-sectional...
Increased functionality requirements coupled with progressively reducing package size have necessitated the integration of flip chip packages into various baseband and application processor products in mobile platforms. Such products use flip chip technology using traditional capillary underfill (CUF) process on a strip based package which is subsequently over molded to finish the end-product assembly...
A new low cost flip chip (LCFC) packaging solution is developed that dramatically reduces flip chip package cost. The solution entails innovations and improvements in the bump, interconnect structure, substrate design and underfilling process. Cu column bumps with solder caps are used to form a “Bump on Lead (BOL)” interconnection with narrow substrate pads with no solder mask confinement (“open solder...
Thermal reliability of nickel (Ni) and copper (Cu) gate AlGaN/GaN high electron mobility transistors (HEMTs) is investigated. Though the current-voltage characteristics of as-deposited Cu gate AlGaN/GaN HEMTs is superior to those of Ni gate AlGaN/GaN HEMTs, severe degradation was observed after aging at 220°C. This instability problem should be carefully taken into account in practical applications...
In this paper we present new approaches in the development of flip chip technology for mobile platforms. We assess the challenges presented by the use of flip chip interconnection as opposed to the traditional approach of wire bonding and present innovative solutions developed to address those challenges. In particular, we describe innovations in the area of routing-efficient interconnection, bumped...
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