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Interfacial delamination is known as one of the root causes of failure in microelectronic industry and therefore is getting more and more attention. In order to be able for judging the risk of interface fracture, the critical fracture properties of the interfaces should be available i.e. Interfacial toughness. Interfacial toughness is strongly dependent on the temperature, the moisture content of...
Interfacial delamination is known as one of the root causes of failure in microelectronic industry and therefore is getting more and more attention. In order to be able for judging the risk of interface fracture, the critical fracture properties of the interfaces should be available i.e. Interfacial toughness. Interfacial toughness is strongly dependent on the temperature, the moisture content of...
Bulk material fracture and interface delamination are main failure modes observed in microelectronic components. Drivers are stresses during processing (e.g. soldering), testing (e.g. moisture sensitivity, thermal cycling) and operation in application environments. For quantitative modeling to predict failures the fracture toughness expressed as critical energy release rate Gc has to be known by measurements...
Warpage of flat packages is partly due to chemical shrinkage of the molding compound during cure and partly due to differences in thermal contraction in the subsequent cooling stage. The latter effect is relatively easy to incorporate in numerical simulations but the cure-induced shrinkage effect is not and is therefore often neglected in warpage simulations. Recent validation studies however showed...
Delamination of interfaces is known as one of the root causes of failure in microelectronic industry and therefore is getting more and more attention. In order to be able for judging the risk of the interface fracture, the critical fracture properties of the interfaces should be available i.e. Interfacial fracture toughness. Interfacial fracture toughness is highly dependent to temperature, moisture...
Microelectronic packages can be considered as composite structures fabricated from highly dissimilar materials. Interface delamination related failure often occurs when the packaged devices are subjected to thermo-mechanical loading. The analysis of delamination of a laminate structure with a crack along the interface is central to the characterization of interfacial toughness. Due to the mismatch...
The mechanical properties of polymer encapsulating materials change considerably when packages are exposed to elevated temperatures for longer times. Here we report a systematic study on the change in viscoelastic properties of a commercial molding compound which is stored at 175°C for periods of time ranging up to 4 weeks. It is shown that instead of the expected degradation, the modulus and the...
The present study deals with experimental investigation of the delamination toughness of EMC (epoxy molding compound) and Copper-leadframe interfaces. Test samples were directly obtained from the production line. EMC is attached on copper substrates with various surface treatments. Mixed mode bending experiments were performed under various temperature and moisture environments. The test procedure...
An electronic device cannot perform its designed functions until it is packaged such that it is interconnected with the rest of the system and protected. As an encapsulation material, thermosetting polymers are widely used. It is well known that properties of polymer-based composites like molding compounds are highly affected by the influence of temperature, relative humidity and degree of conversion...
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