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Interfacial delamination is known as one of the root causes of failure in microelectronic industry and therefore is getting more and more attention. In order to be able for judging the risk of interface fracture, the critical fracture properties of the interfaces should be available i.e. Interfacial toughness. Interfacial toughness is strongly dependent on the temperature, the moisture content of...
Interfacial delamination is known as one of the root causes of failure in microelectronic industry and therefore is getting more and more attention. In order to be able for judging the risk of interface fracture, the critical fracture properties of the interfaces should be available i.e. Interfacial toughness. Interfacial toughness is strongly dependent on the temperature, the moisture content of...
The mechanical properties of polymer encapsulating materials change considerably when packages are exposed to elevated temperatures for longer times. Here we report a systematic study on the change in viscoelastic properties of a commercial molding compound which is stored at 175°C for periods of time ranging up to 4 weeks. It is shown that instead of the expected degradation, the modulus and the...
Interface delamination is one of the most important issues in the microelectronic packaging industry. Silver filled die attach is a typical adhesive used between the die and copper die pad for its improved heat dissipation capacity. Delamination between die attach and die pad will severely impact the heat conduction and result in product failure. In order to predict this delamination, interface properties...
An electronic device cannot perform its designed functions until it is packaged such that it is interconnected with the rest of the system and protected. As an encapsulation material, thermosetting polymers are widely used. It is well known that properties of polymer-based composites like molding compounds are highly affected by the influence of temperature, relative humidity and degree of conversion...
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