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A thermoset coating that is applied to an elastic substrate will develop residual stresses during curing because of polymerization shrinkage of the resin. This shrinkage only partly contributes to the residual stresses because, before gelation, the stresses relax completely. In this study, we developed explicit analytical expressions for the curing efficiency factor, the residual stresses, and the...
Bulk material fracture and interface delamination are main failure modes observed in microelectronic components. Drivers are stresses during processing (e.g. soldering), testing (e.g. moisture sensitivity, thermal cycling) and operation in application environments. For quantitative modeling to predict failures the fracture toughness expressed as critical energy release rate Gc has to be known by measurements...
Warpage of flat packages is partly due to chemical shrinkage of the molding compound during cure and partly due to differences in thermal contraction in the subsequent cooling stage. The latter effect is relatively easy to incorporate in numerical simulations but the cure-induced shrinkage effect is not and is therefore often neglected in warpage simulations. Recent validation studies however showed...
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