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This paper describes a systematic approach to design FPGA package for current carrying capability. As we examine silicon, interposer, and package, the profound challenge is found to meet the lifetime of high power device against the greater chance of failures owing to worsen electro-migration in every interconnect level. Our approach consists of practical methodologies to estimate current distribution...
We propose nano-scale Cu direct bonding technology using ultra-high density Cu nano-pillar (CNP) with for high stacking yield exascale 2.5D/3D integration. We clarified the joining mechanism of nano-scale Cu direct bonding using CNP. Nano-scale Cu pillar easily bond with Cu electrode by re-crystallization of CNP due to the solid phase diffusion and by morphology change of CNP to minimize interfacial...
This paper reviews the interconnect and package design of a heterogeneous stacked-silicon FPGA. Up to five dice from two die types are mounted on a passive silicon interposer. A hardware- and software-scalable FPGA family can be created by mixing different combinations of these two die types. The FPGA, inside a low-temperature co-fired ceramic (LTCC) package, consists of two silicon die types-up to...
This paper presents results for assembly and reliability evaluations performed while developing a first of its kind heterogeneous 2.5D HiCTE Ceramic Field Programmable Gate Array (FPGA) package. The heterogeneous device discussed here is a three dimensionally stacked FPGA device integrated with a 28G Transceiver die using a passive interposer. Several thousands of micro bumps are used for making connections...
Channel loss budgets are becoming more stringent as operating speeds increase. The loss mechanisms of these high-speed channels need to be properly understood in order to minimize the channel loss. The conductor loss, including skin effect loss and surface roughness loss as well as dielectric loss will be addressed theoretically and practically in various cases. This paper will study and identify...
TSV (Through Silicon Via)-based interposer has been proposed as a multi-die package solution to meet the rapidly increasing demand in inter-component (e.g. CPU, GPU and DRAM) communication bandwidth in an electronic system. he stacked-silicon die package configuration may give rise to package reliability concerns not observed in conventional monolithic flip-chip packages. 3D finite element method...
This paper describes the industry's first heterogeneous Stacked Silicon Interconnect (SSI) FPGA family (3D integration). Each device is housed in a low-temperature co-fired ceramic (LTCC) package for optimal signal integrity. Inside the package, a heterogeneous IC stack delivers up to 2.78Tb/s transceiver bandwidth. The resulting bandwidth is approximately three times that achievable in a monolithic...
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