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This paper describes a systematic approach to design FPGA package for current carrying capability. As we examine silicon, interposer, and package, the profound challenge is found to meet the lifetime of high power device against the greater chance of failures owing to worsen electro-migration in every interconnect level. Our approach consists of practical methodologies to estimate current distribution...
Nowadays, 2.5D and 3D stacked die technologies are under prosperous development for the benefit of transistor scaling and performance. However, with the trend of higher electrical performance, lower power consumption and cost effective demand, Non-TSV interposer (NTI) is one of the ways to meet the requirement. This paper introduces and demonstrates the NTI process flow, which includes chip-on-wafer...
This paper reviews the interconnect and package design of a heterogeneous stacked-silicon FPGA. Up to five dice from two die types are mounted on a passive silicon interposer. A hardware- and software-scalable FPGA family can be created by mixing different combinations of these two die types. The FPGA, inside a low-temperature co-fired ceramic (LTCC) package, consists of two silicon die types-up to...
This paper describes the industry's first heterogeneous Stacked Silicon Interconnect (SSI) FPGA family (3D integration). Each device is housed in a low-temperature co-fired ceramic (LTCC) package for optimal signal integrity. Inside the package, a heterogeneous IC stack delivers up to 2.78Tb/s transceiver bandwidth. The resulting bandwidth is approximately three times that achievable in a monolithic...
This article consists of a collection of slides from the author's conference presentation on Xilinx's field programmable gate arrays (FPGA) that deploy 28 Gb/s transceivers built with heterogeneous stacked silicon interconnects. Some of the specific topics discussed include: key applications for use; the special features and specifications of the FOGA family of Xilinx products; stacked-silicon packaging;...
Silicon interposer minimizes CTE mismatch between the chip and copper filled TSV interposer resulting in high reliability micro bumps. Furthermore, providing high wiring density interconnections and improved electrical performance are the reasons TSV interposer has emerged as a good solution and getting too much industry attention. Several DOEs and design/material optimizations were performed in order...
For the last few decades semiconductor industry has been following Moore Law effectively, which has resulted in significant miniaturization of transistors and on chip logic circuitry. Below the 28nm node, as design complexity of the IC (Integrated Circuits) increases, cost and risk associated with these designs are becoming prohibitive for many companies. Three dimensions (3D) die stacking methodology...
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