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Procedures for wafer bonding between silicon and InP and between silicon and LiNbO3 at temperatures below 120 °C are reported. The bonding is based on the deposition of functionalized, organic self assembled monolayers.
A new low modulus β Ti-Nb alloy with low elastic modulus and excellent corrosion resistance is currently under consideration as a surgical implant material. The usefulness of such materials can be dramatically enhanced if their surface structure and surface chemistry can be controlled. This control is achieved by attaching a self assembled monolayer (SAM) based on 11-chloroacetyl-1-undecylphosphonic...
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