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The geometry of magnetocaloric effect (MCE) alloys is of great importance to achieve high cooling performance of the magnetic regenerator The parallel thin plates are proven as the possible largest potential for efficient heat transfer [1]. The La(Fe, Si)13-based magnetocaloric plates with a thickness about 0 5 mm are usually fabricated by a so-called thermal decomposition reaction technique in powder...
Magnetic refrigeration based on the magnetocaloric effect (MCE) is an environmentally friendly and energy efficient solid state cooling technology compared with conventional vapor compression approach In recent years, the interest in large MCE materials including Gd5Si4−xGex, LaFe13-xSix, MnFeP(As, Ge), Ni-Mn-based Heusler alloys, and rare-earth manganites has grown considerably due to their potential...
Pit detection study of a thermal contact sensor was carried out by both experiments and simulation. The experimental results showed that the thermal contact sensor was able to detect a small pit with good sensitivity. And the simulation study revealed that the mechanism of pit detection is due to worse cooling, which results in higher sensor temperature, because the sensor/disk spacing is larger on...
Compared to conventional metal heat sinks, CNT-based microfins have exceptional advantage to drag heat out from electronic components due to the unique thermal and mechanical properties of the material. This paper will review the state of CNTs applied as cooling fins in microelectronic systems. The latest progresses will be presented.
The present work aims to study the heat dissipation capability of microchannel coolers with the coolant made of carbon NanoTube (CNT) suspension, which has been reported to have unusually good thermal properties. In this study, silicon microchannel coolers were prepared by the technique of deep ion reactive etching (DIRE). Stable and homogeneous CNT suspension was also produced. Meanwhile, a closed-loop...
Heat dissipation of electronic packages has become one of the limiting factors to miniaturization. The removal of the heat generated is a critical issue in electronic packaging. With the development of thermal management, thermal interface material (TIM) plays a more and more important role in electronics packaging. A new nano-TIM with nanofibers prepared by using electrospinning has been suggested...
As power density in electronic system is approaching a level that conventional cooling methods canpsilat handle, reliability of microsystems is of large concern. In this paper, novel schemes for heat dissipation on electrical components have been reviewed with a strong focus on using carbon nanotubes (CNTs) as cooling fins as a basic approach. With an extraordinary high thermal conductivity, CNT is...
The two-dimensional computational fluid dynamics (CFD) simulations have been done for a series of material parameters of coolants in this paper. The influences of thermal conductivity, density, specific heat and viscosity on cooling have been obtained in the case studies. The pressure drop between the inlet and outlet of the cooling device is dependent on coolant's density and viscosity. Consequently,...
The 2D CFD simulations have been carried out for a series of CNT micro-fin cooling architectures in this paper. The influence of micro-fin structures, fluid speeds and heating powers on cooling effects have been obtained in the case studies, and the numerical results have been compared with our experiment data. The CFD simulations indicate that the fluid speed is the key factor of heat transfer, and...
Air impingement cooling, as a potential air-cooling technique, has been shown to be much efficient and enabled to complement conventional forced convective air-cooling in electronics. To provide reliable references to the computational thermal analyses based on CFD for effective air-cooling technique integrated in microsystem electronics packaging, the numerical simulation based on CFD for air impingement...
The continuously increasing integration and packaging density of microelectronic systems requires high-performance cooling technologies, among which the microchannel cooler is considered as a good approach. This work aims to develop a microchannel cooler with vertically aligned carbon nanotubes as the fins. Carbon nanotubes have unusually high thermal conductivity along with the possibility of small-scale...
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