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Signal and power integrity in electronic design is not an easy subject to teach as it involves both electrical circuit and electromagnetic field as well physical structure of active and passive components. Great effort has been made to develop teaching and evaluating materials for the subject in engineering schools, especially at undergraduate level. This paper describes our work on the development...
Electrostatic discharge (ESD) can cause interference or damage in circuits in many ways e.g., by E- or H-field coupling or via conduction paths. Although we can roughly estimate the voltage and current at the injection point during an ESD event, the real offending parameter is mostly the ESD current spreading throughout the system. Those currents can be simulated if great simplifications of the system...
If a PCB is struck by an ESD the injected current spreads throughout the PCB and returns via attached cables. During the current spread a variety of effects occur: The current spreads on the main ground and power planes, couples into traces and IC lead-frames and bond wires. Further, the PCB and the attached cables can form resonators causing ringing at their natural resonance frequencies. Understanding...
This paper is to alert PCB designers about potential EMI problems caused by ground fills in outer layers of PCB. Ground fills are frequently used on top and bottom layers of PCBs for manufacturing or perceived shielding reasons. However, if not well applied they may cause EMI problem, especially if they form resonators. Several types of situations need to be distinguished, by (1) the resonating structure...
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