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Two time efficient simulation methods for the prediction of the conducted and radiated automotive EMC emission tests, respectively, are presented. To verify the correct prediction of the cable bundle model, a novel cable bundle test bench has been developed. It allows a fully automated network analysis with up to 32 ports. Several types of cable bundles are experimentally characterized under stochastic...
Measurement techniques for time-domain transient currents are widely needed in many EMC applications. Demonstrated to have a lot of potential for this purpose, giant magnetio-impedance (GMI) probes are studied in this paper. Improvements in the probe design, including a balanced circuit for increased signal to noise ratio and an on-probe magnetic-field bias circuit, are proposed. These improvements...
Synchronous buck converters generate broadband noise typically in 50-300 MHz range. In this paper, the root cause of this broadband noise and possible coupling mechanisms are analysed. Then, a list of EMC design guideline for minimizing the broadband noise is presented. The guideline contains circuit level guideline which involves input filtering, component selection, and an effective snubber strategy...
If a PCB is struck by an ESD the injected current spreads throughout the PCB and returns via attached cables. During the current spread a variety of effects occur: The current spreads on the main ground and power planes, couples into traces and IC lead-frames and bond wires. Further, the PCB and the attached cables can form resonators causing ringing at their natural resonance frequencies. Understanding...
This work demonstrates a simple experimental setup to measure ESD-induced voltage to traces on a printed circuit board when ESD current is injected directly onto the outside of a metal case and presents how the induced voltage can be affected by the physical structure of the PCB ground and the metal case. The correlation between ESD-induced voltage and the method of connecting the PCB and chassis...
Near-field scanning systems are a tool for root-cause ESD, EMI, and immunity analysis of electronic systems, as well as qualification methodology for ICs and modules. For emissions, they have developed into a standardized method. Development of universally accepted file formats for data exchange is on-going. Four main types of scanning have been implemented by this and other authors: near-field EMI...
Models of integrated circuits (ICs) allow printed circuit board (PCB) developers to predict radiated and conducted emissions early in board development and allow IC manufactures insight into how to build their ICs better for electromagnetic compatibility (EMC). A model of the power delivery network, similar to the ICEM or LECCS model, was developed for a microcontroller running a typical program and...
Some system level ESD tests do not repeat well if different ESD generators are used. For improving the test repeatability, ESD generator specifications were considered to be changed and a world wide Round Robin test were performed in 2006 to compare the modified and unmodified ESD generators. The test results show the failure level variations up to 1:3 for an EUT among eight different ESD generators...
Near-field probing is often used to determine the sources and coupling paths of an electromagnetic interference problem above a printed circuit board or integrated circuits chip. A wideband universal field analyzer was developed in order to measure circularly and linearly polarized magnetic fields and total electric field in a rapid sequence using a single probe design.
TEM cells or GTEM cells can be used to evaluate the radiated emissions of integrated circuits (ICs). The applicable frequency bandwidth of a TEM cell is limited due to the resonances of higher order modes. This paper describes how a TEM cell can be modified to extend the frequency range without changing the test topology. Several methods are proposed and implemented to suppress the higher order modes...
Currents associated with high-speed digital devices have significant impacts on EMI problems in VLSI design and operation. In this paper, a simple transmission line model was implemented as an initial step to represent the EMI mechanisms associated with an IC package. Numerical modeling results were compared with near field scanning measurements and show that the magnetic field deduced from the measurements...
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