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The p-GaN gate HEMT device architecture is a prime contender for normally-off GaN power transistors. In this work the growth parameters of the Mg doped p-type GaN layer are varied and the impact of Mg out-diffusion and Mg activation on the main HEMT device parameters is studied. The Mg chemical concentration is optimized together with the Mg active concentration to obtain improved device performance...
We describe the fabrication and characteristics of high voltage enhancement mode SiN/AlGaN/GaN/AlGaN double heterostructure FET devices. The Si3N4 not only acts as a passivation layer but is crucial in the device concept as it acts as an electron donating layer (1). By selective removal under the gate of the in-situ SiN, we realize e-mode operation with a very narrow threshold voltage distribution...
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