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Intensive FEA modeling was applied to the investigation of early solder joint failures of WLCSP mounted on test PCBs. In particular, stress in assembly reflow process was studied with 25 balls; 0.4 mm pitch WLCSP and PCBs with specially placed plated though vias. The 25 ball WLCSP in the study has 5×5 ball array, which corresponds to 16 outmost solder joints and nine inner solder joints, all soldered...
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