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Polymer film is general used for stress buffer and dielectric film for Wafer Level Chip Scale Package (WLCSP). Chemical resistance and mechanical resistance of polymer films usually get worse after several processes with chemicals or heat. Weak chemical or mechanical resistance will induce polymer film cracking. Polymer cracking further induces humidity penetration into RDL (Re-distribution Layer)...
Accelerated thermal cycling (ATC) test, though time-consuming, is currently the most widely used reliability test for electronic components. However, a much faster mechanical bend test is often adopted as an alternative for the ATC test. But it is a general guideline that the mechanical reliability test results are meaningful only if the mechanical stresses applied on the test components are either...
The submodeling technique is a powerful analysis tool. The method promotes more accurate analysis and also helps enhance productivity. It has been shown that by using displacement-force cut boundary condition method, it can be made even more versatile. The local stress phenomena of the solder microbump have been solved with this approach to demonstrate the concept. From the simulation model, it is...
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