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A novel 16-channel digitally wavelength-tunable laser is proposed and experimentally demonstrated using a semiconductor optical amplifier and silicon photonic integrated circuit. The device exhibits a laser threshold below 45 mA, SMSR around 20–25 dB and nanosecond switching time.
1064 nm band Ytterbium doped fiber (YDF) laser is proposed and investigated. Using 70 cm YDF and FBG parameter optimization reflectivity and pumping scheme, a high slope efficiency of 50% and low threshold power are obtained. The power variation is less than 0.1 dB in 13 nm tuning span. Using the Vernier effect, near single frequency lasing is realized for the whole tuning range in 2dBm output power.
A novel multilayer dual-mode filter based on substrate integrated hexagonal cavity (SIHC) that supports two degenerated modes is demonstrated. The proposed filter is composed of a modified extended-doublet. By profit from two coupled dual-mode hexagonal cavity and asymmetry feeding structure, three transmission zeros (TZs) are generated. Accordingly, the filter not only has good selectivity due to...
A novel multilayer dual-mode filter based on substrate integrated hexagonal cavity (SIHC) that supports two degenerated modes is demonstrated. The proposed filter is composed of a modified extended-doublet. By profit from two coupled dual-mode hexagonal cavity and asymmetry feeding structure, three transmission zeros (TZs) are generated. Accordingly, the filter not only has good selectivity due to...
A low temperature C2W (Chip to wafer) bonding method is developed for integrating MEMS and electronics into a wafer level package. The diced known good MEMS chip is picked and bonded onto an ASIC wafer using an In based low temperature solder below 200 degC. The C2W bonded MEMS and ASIC wafer is sealed with a cap wafer. The sealed package is characterized for hermeticity and shear strength and found...
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