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This paper proposes a procedure for estimating the location of open or short defects in a Through Silicon Via daisy-chain structure. The equivalent inductance and capacitance are extracted, at low frequency, through the measured and/or computed Z11 parameter of a three dimensional model in which the short and open defects are intentionally created in specific points.
Through silicon via (TSV) based 3DIC has allowed vertical integration of multiple dies for wide I/O configuration. With thousands of TSVs, data transfer rate can be reduced, while maintaining the highest bandwidth compared to the systems in conventional integrated chips and packages. The challenges lie on high yield fabrication process. The trend in dimension of TSV is continuously decreasing, which...
In this paper, eye-diagrams of coupled microstrip channel on Printed Circuit Board (PCB) are estimated using equivalent circuit model. The equivalent circuit model has RLGC terms which are calculated from the physical dimensions of the coupled microstrip channel. Since the coupled microstrip channel is modeled by physical dimensions, eye-diagrams are estimated without 3D Full EM simulation, which...
Noise coupling through the substrate or silicon interposer among adjacent TSVs has a significant impact on the signal integrity of the TSVs. Since resistance and capacitance are dependent on temperature, more accurate electrical models for TSVs should incorporate the temperature dependency of the material. This paper presents high-frequency temperature-dependent RLGC models for two neighboring TSVs...
This paper investigates the motion of air bubbles in grooved journal bearing due to operating speed and groove by using the finite volume method and the volume of fluid method. It shows that the surface tension and wall adhesion of groove are dominant effect on the motion of a trapped air bubble in fluid lubricant of journal bearing at low operating speed. It also shows that the wedge effect of groove...
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