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We report a newly developed design/fabrication module with low-cost single-side ‘low-stress-SiN/polysilicon (poly-Si)/Al’ process for monolithic integration of composite-sensors in versatile sensing-network nodes. A ‘pressure + acceleration + temperature + infrared’ (PATIR) composite sensor is demonstrated, featuring a front-side surface-/bulk-micromachining process with multifunctional SiN/poly-Si/Al...
In this paper, we demonstrate a 3D monolithic integrated thermoelectric IR sensor by using CMOS-MEMS technology. Since CMOS technology is a plane process, wafer-level packaging is used to further improve the system integration density. Both the circuit interface and IR filter are integrated in the thermoelectric IR sensor. In the vertical direction, IR filter is integrated with IR sensor to miniaturize...
This paper presents a hybrid silicon etching processing technique for removing the entire bulk silicon to release microstructure. The proposed method that combines a back-side wet anisotropic pre-etching and a front-side XeF2 dry isotropic post-etching differs from previous works in silicon micromachining. Wet anisotropic pre-etching enhances the low-cost of the proposed method while the XeF2 dry...
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