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An axial magnetic field (AMF) applied to the vacuum arc column in the vacuum tube can make the vacuum arc keeping in diffusion state, even if it is interrupting the short circuit current. In this paper a novel AMF contact with asymmetric structure has been present. In principle, the necessary axial magnetic field would be created by two coils in series behind the static contact plate. The axial magnetic...
In this paper, the design variables of the contacts with two segments coil AMF for a vacuum interrupter (VI), such as the contact diameter, the coil height, the coil thickness and the slot number of the contact were taken as the main design parameters in the orthogonal experiment. And by normalization, the AMF characteristic was numerically simulated using 3D finite element analysis and taken as the...
High precision domain discretization and field solution efficiency is the barrier of electric field numerical simulation for multi-dielectrics and complex structure by finite element method (FEM). In this paper, by applying the adaptive control strategy in the transformation between coarse grid and fine grid, an adaptive multigrid-finite element method (AMG-FEM) based on non-structure grid is presented...
The needs to integrate devices into portable products with smaller form factor and more functionality have fueled enormous growth of 3D packaging technology. The package-on-package (PoP) is one of the 3D packaging solutions, by which the packaging and assembly houses can achieve a lower cost, faster turn benefits and testing prior to assembly. PoP is a complicated system with multi-layered structure,...
The package technology has matured significantly over the past several years, shifting from conventional components and direct board level assembly to chip or package level system integration. Two major commonly used approaches are System-on-Chip (SoC) and System-in-Package (SiP). Package-on-Package (PoP) that integrates logic die in the bottom package and memory die in the top package into a single...
A U-shaped ironless permanent magnet linear synchronous motor, made by our group, is studied in this paper. The magnetic flux density stabilization is a primary problem, as the air-gap magnetic field with normal component of flux density of longitudinal sine and latitudinal uniformity is required for many precise positioning systems. We proposed a design optimization to improve the magnetic flux density...
The mechanical bending test results, as well as the modeling and calculation data were presented in this study to characterize the solder joint reliability. Bending test was completed simply by loading a series of displacements on the FR-4 printed circuit board (PCB) with devices and solder joints in single direction. A special bending tester that can control displacement exactly by a cam system was...
The 3D FE simulation performed in this work was used to deal with the experimental measured data, and to get the Coffin-Manson equation for lifetime prediction. Low cycle fatigue tests and FE simulations were performed on Sn-8Zn-3Bi lead free solder joints, and the Sn-37Pb eutectic solder was used as reference. The Coffin-Manson equation for the Sn-8Zn-3Bi lead free solder was fitted from the experimental...
Flip chip packaging with anisotropically conductive adhesive (ACA) joint is increasingly used in the electronic industry because of its environmental benefits, fine pitch capability and simpler process. The mechanical deformation has a great impact on electricity ability of the particles in flip chip assembly. The stress analysis of ACA joining in flip chip assembly is one of key steps towards a better...
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