The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
A high thermal conductivity of the underfill material is key for efficient heat removal from 3D chip stacks. Recently, the excellent thermal properties of underfills in which nanoparticle self-assembly formed necks between the filler particles were demonstrated. To industrially apply neck-based thermal underfills, the robustness of neck formation must be improved. Accordingly, it is crucial to understand...
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.