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Herein we report the formulation of phenolic resin–based adhesive to join SiC substrates for a wide range of application temperatures. The formulation consists of phenolic resin as a binder and a mixture of B4C, Al2O3, Y2O3, Si, and SiO2 powders as active filler. The X‐ray diffraction, thermogravimetric analysis, porosity, and scanning electron microscopy analysis were carried out to understand the...
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