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Au/Ni metallization has become increasingly common in microelectronic packaging when Cu pads are joined with Pb-Sn solder. Recent work has shown that a ternary compound with stoichiometry Au0.5Ni0.5Sn4 redeposits onto the interface during aging, compromising the strength of the joint. In the present work the growth of the Au0.5Ni0.5Sn4 layer is documented and methods for inhibiting its growth were...
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