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In allusion to the problem of fragmentary annotation in some GIS software, the author points out one new method: connection of annotation and geographical object. Taking the dynamic annotation of curve for example, the author discusses its process in detail, which is applied to the development of our own GIS software.
This paper is to investigate the fatigue life of solder balls when the BGA package is subjected to vibrating loads. To be compliant with the green package requirement, solder balls made of unleaded material, Sn-Ag-Cu, is chosen. Finite element method is performed to analyze the mechanical responses of BGA package, and fatigue life of solder balls can then be predicted by substituting the calculated...
To obtain probability distribution of random life of a package such as that shown in prototyping testing, some parameters involved in the finite element and life prediction analyses of a certain type of wafer-level chip-scale package (WLCSP) are considered random variables in the present paper. First, the solder-bump size of the package is modeled as a random variable in consideration of real manufacturing...
To study the quantitative reliability of electronic packages, a finite element analysis, with the assumption that certain geometric parameters are random variables, is carried out for a flip-chip package. The maximum strain of the package subject to thermal-cyclic loading is obtained, and the fatigue life of the package is determined based on a modified Coffin-Manson equation. Both quantities derived...
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