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Laser processing is playing an increasing role in advanced packaging. Miniaturization is an obvious driver. As features shrink lasers can play to their core strength of creating intricate features with low damage to surrounding material. But quality is not everything and overshooting the quality goal can mean the process gets more expensive than necessary. The cost of ownership or cost per part has...
This paper describes the first demonstration of 8–10µm diameter micro-vias at 20µm pitch in ultra-thin dry-film polymer dielectrics to achieve high-density and low-cost redistribution layers (RDL) on panel-based glass and organic interposers. A polymer dielectric dry-film, ZEONIF ZS100, at 10µm thickness was double side laminated on thin and low CTE glass and organic substrates. Micro-via arrays at...
Gallium nitride (GaN) layers grown on sapphire substrate wafers have been successfully separated using a novel line beam laser lift‐off (LLO) approach. The absorption of the 248 nm excimer laser radiation by the GaN through the sapphire wafer results in the formation of metallic gallium and nitrogen gas. The sapphire wafer was easily removable by heating above the gallium melting point. The metallic...
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