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A DC-AC power inverter contains parasitic inductances in a DC-linked wire and a load wire. These parasitic components may cause oscillation in the output voltage of the inverter, and cause electromagnetic interference (EMI) issues to other power electronic circuits in the system. In this paper, an effect of the parasitic inductances on the DC-linked wire and load wire of the power inverter are analyzed...
In this paper, we propose and analyze a smartwatch strap wireless power transfer (WPT) system using flexible PCB coils and magnetic field shielding materials. To ensure the sufficiency power delivery, we addressed the changes in impedance of the curved WPT coil system using 3D EM simulation and Z-parameter analysis. Using the proposed scheme, we achieved coil to coil power transfer efficiency of 50%.
Wireless power transfer (WPT) system has been developed to achieve higher charging power and convenient charging experience to users. In some mobile electronic devices with WPT system near-field communication (NFC) system can also be utilized. However, during the wireless charging, large voltage is induced in the NFC tag due to the magnetic fields from the wireless charging system. Consequently, the...
In this paper, we propose chip-level wireless power transfer (WPT) scheme for the next generation high density wireless three-dimensional (3-D) semiconductor packaging technology. We designed a transmitter coil on an active silicon interposer embedded in a PCB-package and a receiver coil on a processor die. The proposed WPT scheme used magnetic-field resonance coupling for high power transfer efficiency...
Simultaneous switching noise (SSN) occurs when clock synchronized core circuits switch simultaneously. Furthermore, a huge amount of the SSN generated by simultaneous switching current (SSC) with high power distribution network (PDN) impedance at anti-resonance can cause electromagnetic interference (EMI) problems and logic failure. In multi-core processors, the spectrum of SSC is varied by power...
In this paper, a vertical probe card consisting of a probe head and a multi-layer ceramic (MLC) board is designed to test wafer-level mobile application processor (AP) chips under LPDDR4 channel specifications. Compared with previously designed probe cards, the newly developed probe card improves signal and power integrity to guarantee the wafer-level AP chips to be operated at 3.2 Gbps speed. In...
In this paper, a vertical probe card design for wafer-level mobile application processor (AP) chip test is proposed under LPDDR4 channel specifications. The probe card consists of a probe head and a multi-layer ceramic (MLC) board, and it is designed to have signal and power integrity to guarantee the wafer-level AP chips to be operated at 3.2 Gbps of speed under 1.1 V of supply voltage. We proposed...
2.5-Dimensional integration based on glass interposer technology is a potential means of achieving high-bandwidth and high-integration density electrical systems. Ultra-low loss glass substrate enables high-frequency signaling but this low loss substrate is vulnerable to the noise suppression in the power distribution network (PDN). Electromagnetic Band-gap (EBG) structures in the PDN are well-known...
Metamaterials with negative relative permeability can change magnetic field in the opposite direction. It can also change the magnetic field direction to straight if it has zero relative permeability. Previously reported metamaterials use only single characteristic which is a negative or a zero permeability to enhance efficiency by field confinement in wireless power transfer (WPT) systems. In this...
In this paper, we propose and demonstrate a chip-level wireless power transfer (WPT) interconnection scheme to reduce power supply interconnections for high-density 3-dimensional integrated circuits (3-D ICs). We fabricated an active chip to design a receiver coil, full-bridge rectifier and DC/DC converter to get DC power from wirelessly delivered AC power from a printed circuit board (PCB) package...
In this paper, we first propose a ground network model of an arbitrary shaped multi-layer printed circuit board (PCB)/chassis for accurate and efficient analysis of audio frequency ground noise coupled from a time division multiple access (TMDA) RF power amplifier (PA) to an audio circuit in a smartphone system. We designed test vehicles with varied extent in the ground noise coupling. We successfully...
In this paper, we first propose and demonstrate an interposer-level wireless power transfer (WPT) scheme to reduce the number of wired power supply interconnections for high-density silicon interposer-based 2.5-D and 3-D integrated circuits (2.5-D and 3-D ICs). We first suggest the concept of an active silicon interposer, fabricate it with active circuits for WPT, and finally proved its WPT operation...
High-power wireless power transfer system (WPT) with high voltage and/or high current can be very dangerous to both engineers and consumers because the probability of explosion is much higher than that of low-power WPT system. Therefore, safety and reliability issues of a coil module in WPT systems should be verified before the actual experimental test. In this paper, a coil module verification process...
The output voltage and current from dc-ac inverter generate switching noises and may cause electromagnetic interference (EMI) problems to other electronic systems. To analyze high frequency switching behavior of an inverter accurately, an accurate IGBT model is essential. In this study, an insulated gate bipolar transistor (IGBT) is modeled using datasheet and measurement data to analyze the high...
In this paper, a new on-interposer passive equalizer was proposed for chip-to-chip high-speed serial data transmission. It is a coil-shaped shunt metal line and embedded on a ground plane to maximize channel routability. Since the proposed equalizer is based on the fine pitch design rules of silicon interposer, it can be integrated in a small area. Equalizing method is based on a high pass filter...
In this study, an inverter model including non-ideal Insulated Gate Bipolar Transistors (IGBTs) characteristics and a busbar model using impedance measurement is proposed. A motor drive system in Hybrid Electric Vehicle (HEV) consists of a battery, an inverter, a cable, and an electric motor. The inverter is not only a voltage source, but also one of the principal noise sources in the motor drive...
In this paper, the equivalent circuit model of the return paths of common mode electromagnetic interference (EMI) noise currents from the motor drive system (MDS) in hybrid electric vehicle (HEV) is proposed. The proposed model includes three kinds of the return current paths: braided shield of three-phase cable, metallic vehicle body and the parasitic capacitance between the vehicle components. In...
Metamaterial composed of artificial periodic structure is applied to a wireless power transfer system to enhance the efficiency of long distance power transfer. Metamaterial can control the direction of magnetic fields due to its negative permeability. Previously reported metamaterials were too thick and large in size to increase the power transfer distance. In this paper, ultra-thin (0.16 cm) and...
In this study, magnetically coupled coil design for high efficiency wireless power transfer (WPT) in PCB-toactive silicon (Si) interposer is proposed and analyzed using Z-parameter analysis. For strong magnetic coupling between transmitter (Tx) coil on PCB and receiver (Rx) coil on Si-interposer, each coil structure is selected considering process dimension difference between PCB and Si-interposer...
In this study, a Wireless Power Transfer (WPT) system design on active silicon (Si) interposer for low voltage applications in 3D-IC is proposed. The proposed WPT system includes magnetically coupled coils, a full-bridge rectifier, and a voltage regulator. In order to validate the proposed system, we first design all of the system components. First, we design a three dimensional helix-type transmitter...
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