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In this paper we will demonstrate a systematic approach for controlling the inputs around a measurement process which has been applied at GLOBALFOUNDRIES Fab 8. The approach covers a wide range of topics which are each individually known but not uniformly applied across the industry. We will discuss the various manufacturing control factors involved around performing a measurement, which can be considered...
We discuss utilization of TMU (Total Measurement Uncertainty) analysis based on Mandel Regression for scatterometry model referencing. We demonstrate practical instances where the reference metrology uncertainty seems to exceed that of the scatterometry model which, in turn, forces the TMU analysis into an invalid regime. Knowing that the source of this result is the wrong estimation of the reference...
In this paper we will demonstrate a systematic approach for controlling the inputs around a measurement process which has been applied at GLOBALFOUNDRIES Fab 8. The approach covers a wide range of topics which are each individually known but not uniformly applied across the industry. We will discuss the various manufacturing control factors involved around performing a measurement, which can be considered...
We discuss utilization of TMU (Total Measurement Uncertainty) analysis based on Mandel Regression for scatterometry model referencing. We demonstrate practical instances where the reference metrology uncertainty seems to exceed that of the scatterometry model which, in turn, forces the TMU analysis into an invalid regime. Knowing that the source of this result is the wrong estimation of the reference...
In this paper we will demonstrate a systematic approach to significantly improve and sustain a large fleet of thickness metrology tools being used for several advanced nodes and products including 10/7nm at GLOBALFOUNDRIES Fab8 site. This challenge is compounded due to having multiple platforms of tools in the same fleet (heterogeneous tool matching) — Aleris 8350, Aleris 8510 & LD10 Ellipsometry...
In this paper we discuss the impact of these two effects on the film thickness measurement and describe our approach to develop a film stack model and recipe which accounts for the underlying stack as well as Chemical Mechanical Planarization (CMP) variation. We also describe the verification and production implementation of this model using mass production data.
White light interferometry (WLI) has been used in the semiconductor industry for the measurement of topography, step height, and via depth, utilizing its fundamentally short coherence length. This allows the tool to achieve nanometer level resolution, making this technique ideal for through silicon via (TSV) measurements for high aspect ratio vias. In this paper, we will discuss one of the important...
High aspect ratio through silicon vias (TSV) present a challenge for measurement of bottom critical dimension (BCD) and depth. TSVs smaller than 5 micron diameter with greater than 12∶1 depth to BCD aspect ratio have particularly poor signal to noise ratio in the measured signal. This paper proposes a method for improving the interferometric measurement of these very small and high-aspect ratio TSVs...
This paper discusses the development and implementation of a Broadband Spectroscopic Ellipsometry (BBSE) composition measurement to characterize a tri-layer stack consisting of 2 SiGe layers of different Germanium concentrations topped by an epitaxial Si layer. The designed experiment wafer set and the composition model development based on AES and XRD reference data are discussed. The spectral sensitivity...
Ever increasing complexity in advanced patterning and new multilayer integration schemes pose significant development and control challenges as industry transits to 2x and below technology node. Accurate process characterization with quick turn-around time is the key for process development. This is particularly true when multiple patterning and integration schemes need to be evaluated and compared...
This paper describes an innovative approach to scatterometry modeling, significantly reducing time to solution compared to the industry's current best practices. One of the drawbacks to traditional scatterometry measurement techniques is the time required to optimize the model, which includes material optical constant extraction, model build time, initial model optimization, and model testing. A novel...
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