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Wire bonding is still the dominating technology for realizing the first level contact of semiconductors. In the last decades miniaturization and increasing connection density resulted in new challenges in terms of reliability and long term stability. But now additionally the movement towards harsher application environments leads to new problems due to aggressive media like oily or salty atmosphere...
Failure analysis and material characterization for power electronics packaging is critical, yet extremely challenging due to the large variety of technologies and materials employed. The current paper presents two case studies describing how defects at the nano-and microscale can greatly impact the performance and functionality of the entire power module. The first example correlates the microstructure...
Within this paper the application potential of a new fast Plasma FIB system for defect analysis regarding packaging reliability studies is evaluated. Depending on the material under investigation both the higher current and the higher sputter efficiency of the Xe significantly improve the range of application fields and/or the analysis throughput. This makes the Plasma FIB a very attractive tool for...
Current developments in the automotive and aerospace industries frequently result in increasing temperatures, reliability and lifetime requirements for power electronic components, modules, and systems. In this context, a key aspect with enormous potential for improvement is the packaging. This includes the required implementation of new advanced materials for high temperature applications of up to...
Due to the RoHS and WEEE legislative requirements the implementation of lead free solder material is of prior significance in electronic manufacturing. As a consequence, many efforts have been started in order to adapt the soldering technology as well as to provide adequate equipment and materials. While European RoHS regulations currently exempt high Pb solders used as component solders and die attaches...
Wir berichten ber ein 3jhriges Mdchen, das wegen statomotorischer und mentaler Retardierung, generalisierter Muskelhypotonie und bermigem Wachstum zur klinisch-genetischen Diagnostik kam. Zytogenetisch wurde eine De-novo-Deletion 22q13 festgestellt. In der Literatur wurden 7 Patienten mit einem hnlichen Phnotyp beschrieben. Diskussion: Es ist zu vermuten, da im Deletionsintervall 22q ein Wachstumsgen...
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