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Wire bonding are utilized as 1st level interconnection in all electronic devices. The reliability of the bonded wires are assessed by wire bond shear test. In this paper the evaluation of the stress and strain response of the gold ball bond during wire bond shear test using finite element analysis is presented. A 3D non-linear finite element model was developed for the simulation. The effects of the...
High power LED are captivating attention due to its cogent impacts on lighting industry in terms of efficacy, low power consumption, long lifetime and miniature physical size. Nonetheless, the efficiency and reliability of the LED is signified by the junction temperature. This work demonstrates the thermal and stress simulation of single chip LED package with 1mm x1mm x 1mm copper heat slug. The simulation...
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